RF Micro Devices has expanded its Beijing facilities to include increased assembly capacity and the addition of new advanced capabilities.

"Our Beijing expansion reflects our commitment to support our customers with operational scale, technological innovation and an industry-leading cost structure," said Bob Bruggeworth, RFMD's president and CEO.

The expansion is expected to support RFMD's POLARIS 3 RF solution, which is currently scheduled to ramp production in the current quarter. The increased capacity will approximately double assembly capabilities related to RFMD's transmit modules. Capacity of wire bond and test capabilities will be expanded in the current quarter, and full capacity will be available by November 2007.

In addition, new advanced capabilities added in RFMD's Beijing facility will include flip chip packaging technology and the Company's patent-pending internal RF shielding technology. RFMD is also developing proprietary RF test platforms internally, as well as working in conjunction with third party suppliers, for advanced transceiver module testing. At completion, the 200,000-square foot expansion and new enabling technologies are expected to streamline RFMD's supply chain, speed time to market and reduce manufacturing and inventory carrying costs.

RFMD's POLARIS 3 is a complete RF solution. It features a highly integrated radio transceiver module that incorporates a single-chip CMOS EDGE transceiver, the full crystal oscillator and all necessary receive filter functionality. The solution also features RFMD's industry-leading front end technology, including the power amplifier and transmit/receive switch. Finally, the revolutionary POLARIS 3 RF solution includes integrated RF shielding and will benefit from RFMD's patent-pending integrated RF shielding technology.